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0.8mm Thick Electronic Scale Fr4 PCB / 94V0 Electronic printed circuit board

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Buy cheap 0.8mm Thick Electronic Scale Fr4 PCB / 94V0 Electronic printed circuit board assembly from wholesalers
  • Buy cheap 0.8mm Thick Electronic Scale Fr4 PCB / 94V0 Electronic printed circuit board assembly from wholesalers

0.8mm Thick Electronic Scale Fr4 PCB / 94V0 Electronic printed circuit board assembly

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Brand Name:XCE
Model Number:XCEM
Certification:CE,ROHS, FCC,ISO9008,SGS,UL
Price:negotiation
Payment Terms:T/T,Western union
Supply Ability:1, 000, 000 PCS / week
Delivery Time:5-10 days
Company Data
Site Member
Contact Person karen
Business Type: Manufacturer
Officials: Room 403 Block A,Huafeng SOHO Creative World Hangcheng Industrial Zone Qianjin 2nd Road,Xixiang Baoan Shenzhen,China
Quality: Quality Certifitation Available
Product Details Company Profile
Product Details

0.8mm Thick Electronic Scale Fr4 PCB / 94V0 Electronic printed circuit board assembly


Quick detail:

Origin:ChinaSpecial: FR4 Material
Layer:6Thickness:1.6mm
Surface: ENIGHole:0.5

Specification:

Electronic Scale PCB With 0.8mm Thickness 94V0 Electronic Board Green Soldermask White Silkscreen,

FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material in production of multilayer printed circuit board,This kind of product is mainly used for double-sided PCB, dosage is very large. Epoxy glass fiber cloth substrate, the most widely used model for FR - 4, in recent years because of the electronic product installation technology and PCB technology development needs, appeared high Tg FR - 4 products.


General FR-4 differs from high Tg FR-4: in the hot state, especially in the heat after moisture absorption, the mechanical strength of the material, dimensional stability, adhesion, water absorption, thermal decomposition, differences in thermal expansion and other various conditions, high Tg products significantly better than conventional PCB substrate material.


What is Immersion Gold: The method of reduction reaction by chemical oxidation coating layer, generally thicker, a chemical nickel gold layer deposition method can achieve a thicker layer of gold, usually called Immersion Gold.


Immersion Gold is gold-plated crystal structure than the more dense and difficult to produce an oxide.

As more and more dense wiring, line width, spacing has to 3-4MIL. Gilded gold is prone to short-circuiting. Only nickel immersion gold plate gold on the pad, it will not yield to the gold shorts.


Parameter:


oItemData
1Layer:1 to 24 layers
2Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3Board thickness:0.20mm to 3.4mm
4Copper thickness:0.5 OZ to 4 OZ
5Copper thickness in hole:>25.0 um (>1mil)
6Max. Board Size:(580mm×1200mm)
7Min. Drilled Hole Size:4mil(0.1mm)
8Min. Line Width:3mil (0.075mm)
9Min. Line Spacing:3mil (0.075mm)
10Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11Solder Mask Color:Green/Yellow/Black/White/Red/Blue
12Shape tolerance:±0.13
13Hole tolerance:PTH: ±0.076 NPTH: ±0.05
14Package:Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15Certificate:UL,SGS,ISO 9001:2008
16Special requirements:Buried and blind vias+controlled impedance +BGA
17Profiling:Punching, Routing, V-CUT, Beveling

UL 94: Test for Flammability of Plastic Materials for Parts in Devices and Appliances
Level test program are as follows:
1) HB Grade: horizontal burning test Horizontal Burning Test
2) V0-V2 level: vertical flame test Vertical Burning Test
3) 5VA / 5VB: 5V-fire test 500w (125 mm) Vertical Burning Test
4) RP Class: radiant panel flame spread testing Radiant Panel Flame Spread Test
5) VTM0-VTM2: thin material vertical combustion test Thin Material Vertical Burning Test
6) HF1-HF2: foam level material combustion test Horizontal Burning Foamed Material Test

Company Profile

Shenzhen Xinchenger Electronic Co.,Ltd

Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards.

 

We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,4G antena so on and so forth. Our company's sufficient stocks of hi-frequency pcb materials such as Rogers,TACONIC,Arlon,Isola,F4B,TP-2,FR-4 (dielectric rage:2.2-16) mainly used in the area of high technologies like communication device,Electronics,Aerospace,Military industry to meet our worldwide customers with high quality. Furthermore,we also keen on helping customers shorten the period of production development and 24 hours of sample service is available.

 

Since the day of company foundation we continuously engaged in researching special and high precision printed circuit boards with the strong production capability of 2 to 28 layers of highly precise impedence,multi-layer blind buried,multi-layer mix-compression,high TG, copper substrate,Ceramic substrate PCB. We emphasize the significance of traning program for every single staff in the company even grass-roots employees which becomes the most competitive factors to excel from others,our company have many experienced and professional teams from management to production line,30% are highly educated among the total amount of employees,advanced engineers and senior technicians are up to 80 people.

 

With advanced foreign technology supports and domestic 3G/4G device manufacturer in microwave pcb field which lead our experienced hi-frequency researching team to one step ahead of the line of printed circuit board business,we are honored to obtain sound reputations over our worldwide customers on the basis of fine qulity,prompt delivery,satisfied after sales service for may years and we assure our customers that we will return the favors with more and more superior products in the near future.

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