
Sort | Chemical composition (wt.%) | ||||||||
Sn | Pb | Sb | Cu | Bi | Ag | Fe | Al | Cd | |
Sn96.5Ag3.0Cu0.5 | Bal. | < 0.10 | <0.10 | 0.5±0.1 | <0.10 | 3.0±0.05 | <0.02 | <0.002 | <0.002 |
3. Physical Properties:
Sort | Melting Point (℃) | Spec. Gravity (g/cm3) | Tensile Strength (MPa) |
Sn96.5-Ag3.0-Cu0.5 | 217-219 | 7.40 | 53. |
4. Our Superiority is the Professionalism of our team.
- PCB And PCB Assembly For One-stop Service with Original Components According the BOM.
IC Imported from Digikey / Farnell etc.
- Low Cost with High Quality, Commitment of Quality Assurance.
- For 10 years Experience in PCB Field. ( Our Factory owns advanced
production equipment and experienced technical personnel. )
5. Detailed specification of manufaturing capacity:
NO | Item | Craft Capacity |
1 | Layer | 1-30 Layers |
2 | Base Material for PCB | FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS ,TEFLON, ARLON, Halogen-free Material |
3 | Rang of finish baords Thickness | 0.21-7.0mm |
4 | Max size of finish board | 900MM*900MM |
5 | Minimum Linewidth | 3mil (0.075mm) |
6 | Minimum Line space | 3mil (0.075mm) |
7 | Min space between pad to pad | 3mil (0.075mm) |
8 | Minimum hole diameter | 0.10 mm |
9 | Min bonding pad diameter | 10mil |
10 | Max proportion of drilling hole and board thickness | 1:12.5 |
11 | Minimum linewidth of Idents | 4mil |
12 | Min Height of Idents | 25mil |
13 | Finishing Treatment | HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, etc. |
14 | Soldermask | Green, White, Red, Yellow, Black, Blue, transparent photosensitive soldermask, Strippable soldermask. |
15 | Minimun thickness of soldermask | 10um |
16 | Color of silk-screen | White, Black, Yellow ect. |
17 | E-Testing | 100% E-Testing (High Voltage Testing); Flying Probe Testing |
18 | Other test | ImpedanceTesting,Resistance Testing, Microsection etc., |
19 | Date file format | GERBER FILE and DRILLING FILE, PROTEL SERIES, PADS2000 SERIES, Powerpcb SERIES, ODB++ |
20 | Special technological requirement | Blind & Buried Vias and High Thickness copper |
21 | Thickness of Copper | 0.5-14oz (18-490um) |
6. Quote Requirements for PCB and PCB Assembly project:
- Gerber File and Bom List;
- Quote Quantity;
- Advise your technical requirements for quoting reference;
- Clearly picturers of PCB or PCB Assembly Sample to us for reference;
- Test Mothod for PCB Assembly.
7. T-SOAR Factory Silhouette:
Ping You Industrial Co.,Ltd